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              機械解鍵合系統

              Samcien自主研發的WLP TB4130(Adhesive Layer)+WLP MB3100(Release Layer)體系材料,可應用于小尺寸(一般4~8寸)超薄晶圓加工,通過Release層對粘結力的特殊調控,使得晶圓鍵合對在減薄、光刻、刻蝕、鈍化、電鍍、植球等制程中具有足夠的粘接力,又可在完成制程后通過機械外力解鍵合方式將器件晶圓與支撐晶圓分離。并利用配套清洗劑去除器件晶圓上殘留的有機物以及載片回收。


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