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              無氰化學鎳金(ENIG)

              Samcien自主研發的WLP EN/EG系列產品,可應用于晶圓級封裝、IC載板、及PCB、FPC等表面處理工藝ENIG的制作及線路的保護。其中無氰化學金WLP EG-61使用無氰金鹽替代傳統氰化物金鹽,廢液低毒污染型小,通過半置換半還原的方式沉積金層。此外,通過絡合物等關鍵助劑的設計調控,使得制備的鎳/金層具有優異的平整性、抗腐蝕性、電磁屏蔽性及可焊性優異等特點,符合HJ484-2009及GB21900-2008要求。


              詳細產品信息請聯系
              市場部陳經理18018149237/13530844812

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